Niche-Tech Group Limited manufactures semiconductor packaging materials. It specializes in the development, manufacture and sale of bonding wire and encapsulant. The company was founded in 2006 and is headquartered in Hong Kong.
Headquarters
Unit 208, 2/F, Lakeside 1, Phase Two, Hong Kong Science Park, Pak Shek Kok, New Territories
Hong Kong; Hong Kong;
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Website: http://www.nichetechcorp.com
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