Win Pac Inc.. is engaged in semiconductor business. The company provides package products and testing services such as fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP), flip chips as well as testing services like final testing on memory products, such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash and pseudo-static random access memory (PSRAM). Win Pac Inc. is based in Yongin, Gyeonggi-do Province, South Korea. The company was incorporated in 2002 formerly known as IPACK Inc.
Headquarters
351-25 Gachang-Ri, Baekam-Byeon, Cheoin-Gu, Yongyin-Si
Yongin; Gyeonggi;
Contact Details: Purchase the Win Pac Inc. report to view the information.
Website: http://www.winpac.co.kr
EMIS company profiles are part of a larger information service which combines company, industry and country data and analysis for over 145 emerging markets.
Request a demo of the EMIS serviceTo view more information, Request a demonstration of the EMIS service