Mi Technovation Berhad is a semiconductor equipment solutions provider for the automotive and telecommunications industries, with a focus on EV and 5G markets. The company offers precision die bonding solutions, laser bonding equipment, and advanced technology solutions for wafer fabrication, back-end assembly, and final test. The company operates globally with R&D centers and manufacturing facilities in Malaysia, China, and Korea, and sales networks covering Southeast Asia, North America, and Europe.
Headquarters
No. 20, Medan Bayan Lepas Technoplex, Mk 12 Taman Perindustrian, Bayan Lepas
Bayan Lepas; Penang;
Postal Code: 11900
Contact Details: Purchase the Mi Equipment (M) Sdn. Bhd. report to view the information.
Website: http://www.mi-eq.com
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