Unisem (M) Berhad provides semiconductor assembly and test services in Malaysia. Unisem’s semiconductor packaging and test facilities are located in Ipoh, Perak, Malaysia. Unisem offers integrated suite of packaging and test services, such as wafer bumping, wafer probing, wafer grinding, as well as range of leadframe and substrate integrated circuits packaging, wafer level chipscale packaging and radio frequency, analog, digital and mixed-signal test services. Its services include design, assembly, test, failure analysis, and electrical and thermal characterization. Unisem also has factory locations in Crumlin, South Wales, the United Kingdom; Chengdu, Batam, Indonesia and Sunnyvale, California, USA. Unisem was founded in 1989 and based in Kuala Lumpur, Malaysia. The company is listed on Bursa Malaysia under the Main Market.
Legal Address
Lot No. 9(H), 9th Floor Ubn Tower,10, Jalan P. Ramlee
Kuala Lumpur; Federal Territories;
Postal Code: 50250
Contact Details: Purchase the Unisem (M) Berhad report to view the information.
Website: http://www.unisemgroup.com
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