Advanced Semiconductor Engineering, Inc. is providers of semiconductor packaging and test services. The company develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package and final test. The company was founded in 1984 and is headquartered in Kaohsiung City, Taiwan.
Headquarters
No. 26, Jingsan Road, Nanzi Export Processing Zone, Nanzi District
Kaohsiung City; Kaohsiung City;
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Website: http://ase.aseglobal.com
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