Niching Industrial Corp. (Taiwan, China)

Founded in June 1993, Niching Industrial Corp. became a publicly traded company in 2004 and was listed on Emerging Stock Market in 2007. In 2008 the company was listed in OTC market, Taiwan. In 1998 it established Enplas Semiconductor Corporation, a joint venture with Japanese Enplas and Singapore’s Hy-Cad and in 2011 it founded the subsidiary company, Ingentec Corp. Niching is engaged in the wholesale and retail of semiconductor and optoelectronic products. Its semiconductor products include capillaries, machine tools, lead frames, film wafers, dummy wafers, memory module boards (MMBs), printed circuit boards (PCBs) for flash memory cards, board on chip (BOC) substrates, multi-chip packages (MCPs), land grid array (LGA) substrates, ultra fine line ball-grid-arrays (uBGAs), reclaim wafers and specialty gas, among others. Its optoelectronic products include integrated circuit (IC) chip trays, chip on flex (COF)/tape automated bonding (TAB) tapes, shipping reels, specialty gas and optical films. It also provides silicon powders, laser systems and silicon wafer crucibles. During the year ended December 31, 2009, the company obtained approximately 75% and 15% of its total revenue from its semiconductor products and optoelectronic products, respectively.