"In April 1978 Shen Mao Industry Co., Ltd. was established and was engaged in manufacturing and trading of solder products.In November 1982, solder wire and bar solder resin heart was qualified Zheng mark No. 3423 & 3424 by the Chinese National Standard Bureau.The company developed the oxidation preventing agent,a water-soluble solder wire and the stripping solder mask in 1984,1985 and 1986. In September resin solder wire and bar solder heart was qualified JIS mark No.TW8716 and TW8717 by Japan Industrial Standard.In October it developed antioxidant bar solder. In October 1998, it had technical cooperation with Japan HARIMA manufacturing solder paste.In May 2000, it established Micro-Welding Institute.In March 2001,it developed lead-free solder and in April passed the ISO-14001 environmental certification.In June it developed BGA / CSP / FLIPCHIP balls and other products. In December it invested in Malaysia and Hong Kong in tin processing plant. In September 2002, it signed with the University of Iowa the contract of lead-free solder patent No.5527628. In July 2003, the company went public."
Headquarters
No.665, Datan N.Rd, Guanyin Dist
Taoyuan City; Taoyuan City;
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