In June 2000, the company signed with Israel Business Cher Case Co., Ltd. (Shell Case Ltd.)a technology licensing agreement. It introduced wafer level packaging technology and began to deal with the integrated circuit packaging business. In October the company was allowed into Jhongli Industrial Park, Taoyuan County to set up factories. In October 2001, the company entered the trial and mass production stage. In March 2002 it passed the ISO-9000 quality certification. In February 2003 it passed the QS-9000 quality certification. In December the company went public. The company's service focuses on wafer-level packaging business (Wafer Level Package).The company's packaging technology uses standard wafer processing which has the cost advantage over the general CPS technology. The management team has extensive experience in related industries (foundries, packaging factory, Image Sensor).
Headquarters
9Fl., No.23,Ji-Lin Road, Chung-Li Industry Park
Taoyuan City; Taoyuan City;
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Website: http://www.xintec.com.tw
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